TGV – The Key Tech Driving Glass Substrate Innovation in Semiconductors
In the semiconductor industry, Moore’s Law is edging closer to physical limits. So, boosting chip performance through 3D integration has become a core focus. Advanced packaging technologies like 2.5D/3D packaging and heterogeneous integration demand higher vertical interconnect density and better substrate performance.
Traditional silicon substrates are showing more limits. They struggle with high-frequency signal transmission, manufacturing costs, and process complexity. Glass substrates, however, are emerging as an ideal next-gen choice – thanks to unique advantages.
Through Glass Via (TGV) is the star here. It acts as “micro-channels” in chips, leading the shift from the “silicon era” to the “glass era” in semiconductor packaging.
What is TGV?
TGV refers to vertical electrical interconnects through glass substrates. It’s seen as a key next-gen 3D integration tech, potentially replacing silicon-based TSV (Through Silicon Via).
Made from high-quality borosilicate or quartz glass, TGV uses processes like laser induction, etching, seed layer sputtering, electroplating, chemical mechanical planarization (CMP), RDL, and bumping to enable 3D connections. These micro-vias typically range from 10μm to 100μm in diameter. For advanced packaging, each wafer may need tens of thousands to millions of metalized TGVs for conductivity.
Why TGV beats TSV?
- Better high-frequency performance: Glass is an insulator. Its dielectric constant is about 1/3 that of silicon. Its loss factor is 2-3 orders of magnitude lower. This cuts substrate loss and parasitic effects, keeping signals intact.
- Lower cost: Large, ultra-thin glass panels are easy to get. No need for insulating layers on the substrate or TGV walls. Glass interposers cost ~1/8 of silicon ones, slashing overall packaging costs.
- Simpler processes: No complex insulating layer deposition. No thinning for ultra-thin interposers. This streamlines production and boosts efficiency.
- Strong mechanical stability: Even when interposers are thinner than 100μm, warpage is small. This ensures packaging reliability.
- Wide applications: It shines in RF chips, high-end MEMS sensors, and high-density system integration. It’s a top pick for next-gen high-frequency chip 3D packaging.
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